Electrical Potting Compound silicone potting compound for electronics

Cure without releasing heat
High dielectric strength.
High efficient heat dissipation.
Resistant to various chemicals.
Prevents moisture ingress.
Exhibits strong bonding.
very Low Shrinkage and no corrosion to maintains dimensional stability.
Protects against UV degradation.
high temperature resistance to minimize fire risk.
Simple handling and fast curing.
Perfect tensile and tearing strength.
Very Low shrinkage rate(<0.1%)
Non-deformation

Silicone Electrical Potting Compound

Electrical Potting Compound of silicone potting compound for electronics is a newly silicone potting gel of electronic encapsulation material. this electrical potting compound can cure without releasing heat, is long time bearing without corrosion and performs almost no shrinkage when used as encapsulating electronic components.

Applications:

This Electrical Potting And Encapsulating Silicone Compound is suitable to be electrical potting compound for electronics encapsulation of electronic circuit, power module, control module etc , it can be also used as potting compound for encapsulate LED screen, Wind Power Generator, PCBsubstrate, etc.

Techinical Dataes

Model	Color	Mixing ratio (%)	Pot life (min）	Curing time (under 25℃)	Hardness (Shore A)	Viscosity （After A/B mixed ,mPa.s）
KR-E20	Water clear	1:1	30-60	4-5hrs	20±3	500±100
KR-E25	Water clear	1:1	30-60	4-5hrs	25±3	500±100
KR-E50	Gray/white	1:1	30-60	4-5hrs	50±5	3500±500
KR-E50	Gray/white	1:1	30-60	4-5hrs	55±5	3000±500